Disco Corp - Company Profile
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Disco Corp (Disco) is a manufacturer of semiconductor equipment and precision tools. The company’s product portfolio includes dicing, cutting saws, polishers, laser saws, grinders, wafer mounter, die separator, surface planer and waterjet saw. It offers precision processing tools such as dicing blades, grinding wheels and dry polishing wheels. The company provides solutions such as blade dicing, laser dicing, grinding, Dicing before grinding, and Stealth dicing before grinding. It also provides maintenance, disassembly, recycling and leasing of precision cutting, grinding and polishing machines. The company has presence in North America, Europe, South Korea, China and Asia. Disco is headquartered in Ota-ku, Tokyo, Japan.
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Products and Services
Products | Services |
---|---|
Precision Machines | Blade Dicing |
Dicing Saws | Applications Support |
Laser Saws | Polishing |
XYZ | XYZ |
XYZ | XYZ |
XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
Year | Event | Description |
---|---|---|
2024 | Plans/Strategy | In January, the company announced its plans to build a cutting-edge plant in Hiroshima, Japan. |
2023 | New Products/Services | In March, the company launched Timelines, a cloud-based solution. |
2022 | New Products/Services | In December, the company developed two types of grinding wheels, the Poligrind PW21 Series and the GFSC Series for SiC wafers. |
Competitor Comparison
Key Parameters | Disco Corp | Taiwan Semiconductor Manufacturing Co Ltd | Kanematsu Corp | Kulicke & Soffa Industries Inc | Daito Electron Co Ltd |
---|---|---|---|---|---|
Headquarters | Japan | Taiwan | Japan | Singapore | Japan |
City | Ota-Ku | Hsinchu | Chiyoda-Ku | Singapore | Osaka-Shi |
State/Province | Tokyo | - | Tokyo | - | Osaka |
No. of Employees | 4,553 | 52,045 | 7,866 | 2,877 | 942 |
Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
Name | Position | Board | Since | Age |
---|---|---|---|---|
Kazuma Sekiya | Director; General Manager, Engineering R&D Division; Chief Executive Officer; President; Chief Information Officer; Chief Operating Officer | Executive Board | 2009 | 57 |
Takao Tamura | Chief Financial Officer; Chief Privacy Officer; Director; Managing Executive Officer; General Manager - Corporate Support Division; Chief Environmental Officer | Executive Board | 2018 | - |
Noboru Yoshinaga | Executive Vice President; General Manager-Sales Division; Director | Executive Board | 2019 | 64 |
Yutaka Nishimura | Executive Officer; General Manager - Hiroshima Works | Senior Management | - | - |
Kaoru Sekiya | General Manager - Purchasing Division; Executive Officer | Senior Management | - | - |
Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
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