Disco Corp - Company Profile

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Disco Corp: Overview

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Disco Corp (Disco) is a manufacturer of semiconductor equipment and precision tools. The company’s product portfolio includes dicing, cutting saws, polishers, laser saws, grinders, wafer mounter, die separator, surface planer and waterjet saw. It offers precision processing tools such as dicing blades, grinding wheels and dry polishing wheels. The company provides solutions such as blade dicing, laser dicing, grinding, Dicing before grinding, and Stealth dicing before grinding. It also provides maintenance, disassembly, recycling and leasing of precision cutting, grinding and polishing machines. The company has presence in North America, Europe, South Korea, China and Asia. Disco is headquartered in Ota-ku, Tokyo, Japan.

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Headquarters Japan
Address 2-13-11, Omori-Kita, Ota-Ku, Tokyo, 143-8580
Website www.disco.co.jp
Telephone 81 3 45901111
No of Employees 4,553
Industry Technology and Communications
Ticker Symbol & Exchange 6146 (TYO)
Revenue (2023) $2.1B 12% (2023 vs 2022)
EPS XYZ
Net Income (2023) XYZ 25.2% (2023 vs 2022)
Market Cap* $37.3B
Net Profit Margin (2023) XYZ 11.8% (2023 vs 2022)
* As of and is in US$
View Disco Corp financials
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Disco Corp premium industry data and analytics

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Install Base

Install Base provides a holistic and a granular view of the IT product/service deployments from leading vendors. Explore IT infrastructure categories, solution and product/service areas deployed by a prospect.

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ICT Spend & Tech Priorities

IT Client Prospector provides intelligence on Disco Corp’s likely spend across technology areas enabling you to understand the digital strategy.

Products and Services

Products Services
Precision Machines Blade Dicing
Dicing Saws Applications Support
Laser Saws Polishing
XYZ XYZ
XYZ XYZ
XYZ XYZ
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History

History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.

Year Event Description
2024 Plans/Strategy In January, the company announced its plans to build a cutting-edge plant in Hiroshima, Japan.
2023 New Products/Services In March, the company launched Timelines, a cloud-based solution.
2022 New Products/Services In December, the company developed two types of grinding wheels, the Poligrind PW21 Series and the GFSC Series for SiC wafers.
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Competitor Comparison

Key Parameters Disco Corp Taiwan Semiconductor Manufacturing Co Ltd Kanematsu Corp Kulicke & Soffa Industries Inc Daito Electron Co Ltd
Headquarters Japan Taiwan Japan Singapore Japan
City Ota-Ku Hsinchu Chiyoda-Ku Singapore Osaka-Shi
State/Province Tokyo - Tokyo - Osaka
No. of Employees 4,553 52,045 7,866 2,877 942
Entity Type Public Public Public Public Public
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Executives
Name Position Board Since Age
Kazuma Sekiya Director; General Manager, Engineering R&D Division; Chief Executive Officer; President; Chief Information Officer; Chief Operating Officer Executive Board 2009 57
Takao Tamura Chief Financial Officer; Chief Privacy Officer; Director; Managing Executive Officer; General Manager - Corporate Support Division; Chief Environmental Officer Executive Board 2018 -
Noboru Yoshinaga Executive Vice President; General Manager-Sales Division; Director Executive Board 2019 64
Yutaka Nishimura Executive Officer; General Manager - Hiroshima Works Senior Management - -
Kaoru Sekiya General Manager - Purchasing Division; Executive Officer Senior Management - -
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
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