United Microelectronics Corp - Company Profile
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United Microelectronics Corp (UMC) is a semiconductor foundry that offers circuit design, mask tooling, wafer fabrication, assembly, and testing solutions. Its backend services include turnkey, testing, package solution development and product yield management solutions. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Its design solutions include mask service, silicon shuttle, libraries and IP, design verification, design kit and manual, design flow reference and design for manufacturing. The company’s products find application in communication devices, consumer electronics, computer and high-volume application such as networking, telecommunications, internet, multimedia PCs and graphics. It operates manufacturing facilities in the Tainan Science Park, Southern Taiwan. It has operations across Taiwan, China, Japan, Korea, Singapore, Hong Kong, Europe and the US. UMC is headquartered at Hsinchu City, Taiwan.
Headquarters
Taiwan
Address
No.3, Li-Shin Road Ii, Hsinchu Science Park, 300
Website
www.umc.com
Telephone
886 3 5782258
No of Employees
19,426
Industry
Technology and Communications
Ticker Symbol & Exchange
2303 (TPE)
Revenue (2022)
$7.1B
-20.2%
(2022 vs 2021)
EPS
XYZ
Net Income (2022)
XYZ
-30.1%
(2022 vs 2021)
Market Cap*
$18.8B
Net Profit Margin (2022)
XYZ
-12.4%
(2022 vs 2021)
* As of and is in US$
United Microelectronics Corp premium industry data and analytics
Products and Services
| Products | Services |
|---|---|
| Wafers | Mask Tooling Services |
| Semiconductors | Backend Services |
| Solutions: | |
| XYZ | |
| XYZ | |
| XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2024 | Contracts/Agreements | In January, the company and Intel Corp entered into a partnership for the development of an innovative 12-nanometer semiconductor process platform. |
| 2023 | Contracts/Agreements | In October, the company initiated the W2W 3D IC project in collaboration with Winbond, Faraday, ASE, and Cadence to help customers accelerate the production of their 3D products. |
| 2023 | Contracts/Agreements | In June, the company partnered with Metalenz to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. |
Competitor Comparison
| Key Parameters | United Microelectronics Corp | Samsung Electronics Co Ltd | Taiwan Semiconductor Manufacturing Co Ltd | International Business Machines Corp | Intel Corp |
|---|---|---|---|---|---|
| Headquarters | Taiwan | South Korea | Taiwan | United States of America | United States of America |
| City | Hsinchu | Suwon | Hsinchu | Armonk | Santa Clara |
| State/Province | - | Seoul | - | New York | California |
| No. of Employees | 19,426 | 98,557 | 52,045 | 305,300 | 124,800 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Stan Hung | Chairman; Chief Strategy Officer | Executive Board | - | 62 |
| SC Chien | Director; President | Executive Board | - | 64 |
| Jason Wang | Director; President | Executive Board | - | 60 |
| Chitung Liu | Senior Vice President; Chief Financial Officer | Senior Management | - | - |
| Wenyi Chu | Director | Non Executive Board | - | 56 |
| Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2024 | XY |
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