Winbond Electronics Corp - Company Profile

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Winbond Electronics Corp: Overview

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Winbond Electronics Corp (Winbond) designs, manufactures, and sells specialty memory IC products. The company’s product portfolio includes mobile dynamic random-access memory (DRAM), specialty DRAM, NAND-based MCP, and code storage flash memory. It also carries out product design, mask making, wafer fabrication, packaging, testing, and marketing of brand name products. Winbond offers low to medium density memory solutions to its global clientele. The company serves the automotive, industrial, communication, computer, and consumer sectors. Winbond provides flash memory products for applications in consumer electronics, mobile devices, automotive electronics, medical electronics, IoT and wearable devices. The company has operations and distributor network in Japan, the US, China, Israel and Hong Kong. Winbond is headquartered in Taichung City, Taiwan.

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Headquarters Taiwan
Address No.8, Keya 1st Rd, Cntrl Science Industrl Prk, Daya District, Taichung, 428
Website www.winbond.com
Telephone 886 42 5218168
No of Employees 3,625
Industry Technology and Communications
Ticker Symbol & Exchange 2344 (TPE)
Revenue (2022) $2.4B -20.7% (2022 vs 2021)
EPS XYZ
Net Income (2022) XYZ -108.9% (2022 vs 2021)
Market Cap* $3.6B
Net Profit Margin (2023) XYZ -111.2% (2022 vs 2021)
* As of and is in US$
View Winbond Electronics Corp financials
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Winbond Electronics Corp premium industry data and analytics

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Install Base

Install Base provides a holistic and a granular view of the IT product/service deployments from leading vendors. Explore IT infrastructure categories, solution and product/service areas deployed by a prospect.

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ICT Spend & Tech Priorities

IT Client Prospector provides intelligence on Winbond Electronics Corp’s likely spend across technology areas enabling you to understand the digital strategy.

Products and Services

Products Services Brands
Mobile DRAM: Memory Product Foundry Service :
Pseudo SRAM
Low Power SDR SDRAM
XYZ
XYZ
XYZ
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History

History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.

Year Event Description
2024 New Products/Services In March, the company launched the TrustME Secure Flash W77Q family with 256 Mb, 512 Mb and 1 Gb devices.
2023 New Products/Services In September, the company unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases.
2023 Contracts/Agreements In September, the company entered into a partnership with Mobiveil for an IP controller for low power HyperRAM memory applications.
Dive into past operations, including product releases, deals, acquisitions & more Dive into past operations, including product releases, deals, acquisitions & more Find out more
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Competitor Comparison

Key Parameters Winbond Electronics Corp Taiwan Semiconductor Manufacturing Co Ltd Micron Technology Inc Nanya Technology Corp WIN Semiconductors Corp
Headquarters Taiwan Taiwan United States of America Taiwan Taiwan
City Taichung Hsinchu Boise Taipei Taoyuan
State/Province - - Idaho - Taoyuan
No. of Employees 3,625 52,045 43,000 3,380 1,534
Entity Type Public Public Public Public Public
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Executives
Name Position Board Since Age
Arthur Yu-Cheng Chiao Chief Executive Officer; Chairman Executive Board 2017 -
Tung-Yi Chan Deputy Chief Executive Officer; Vice Chairman Executive Board 2020 -
Chih Chung Chou Chief Financial Officer; Head - Finance Division; Chief Governance Officer Senior Management 2022 -
Pei-Ming Chen President Senior Management 2020 -
Jen-Lieh Lin Vice President - Flash Memory IC Business Group Senior Management - -
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
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