View up-to-date information on Semiconductor Manufacturing International Corp patents, including inventor and filing insights.
Patent Trends
Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
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CN111834331B | Grant | 半导体结构及其形成方法 | H01L23/5228 | September 13, 2022 |
CN113327843B | Grant | 半导体结构的形成方法 | H01L21/0337; H01L21/3086 | September 13, 2022 |
CN115050691A | Application | 半导体结构及其形成方法 | September 13, 2022 | |
CN111755037B | Grant | 读出放大电路以及MRAM电路 | G11C7/06 | September 13, 2022 |
CN115050740A | Application | 半导体结构及其形成方法 | September 13, 2022 |
Top Inventors by Filings (Count by publication)
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