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View up-to-date information on Semiconductor Manufacturing International Corp patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US11837497B2 | Grant | Semiconductor device | H01L21/02381; H01L21/0337; H01L21/76224; H01L21/7624; H01L21/823481 | December 05, 2023 |
| CN117148682A | Application | 版图的拆分方法及系统、设备、存储介质 | December 01, 2023 | |
| CN117153771A | Application | 半导体结构及其形成方法 | December 01, 2023 | |
| CN117156963A | Application | 半导体结构及其形成方法 | December 01, 2023 | |
| CN117153859A | Application | 半导体结构及其形成方法 | December 01, 2023 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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