View up-to-date information on Semtech Corp patents, including inventor and filing insights.
Patent Trends
Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
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US20220285334A1 | Application | Semiconductor Device and Method of Stacking Semiconductor Die for System-Level ESD Protection | H01L21/76898; H01L2224/04042; H01L2224/05611; H01L2224/05644; H01L2224/05655; H01L2224/1132; H01L2224/11462; H01L2224/11901; H01L2224/13111; H01L2224/13155; H01L2224/32245; H01L2224/45124; H01L2224/45139; H01L2224/45147; H01L2224/48247; H01L2224/8082; H01L2224/94; H01L2225/0651; H01L23/295; H01L23/49575; H01L23/60; H01L24/13; H01L24/14; H01L24/16; H01L24/81; H01L24/85; H01L24/94; H01L24/97; H01L25/0657; H01L25/50; H01L2924/10252; H01L2924/143; H01L2924/1461 | September 08, 2022 |
CN112953593B | Grant | LoRa高级接收器 | H04B1/1638; H04B1/69; H04B1/7085; H04B1/7087; H04B2001/6912; H04L1/206; H04L27/103; H04L27/265; H04L27/2662 | September 02, 2022 |
CN114999947A | Application | 形成小z半导体封装的方法和半导体器件 | H01L21/486; H01L21/56; H01L21/561; H01L21/563; H01L21/565; H01L21/568; H01L2224/0401; H01L2224/04105; H01L2224/10; H01L2224/12105; H01L2224/16146; H01L2224/19; H01L2224/32145; H01L2224/32245; H01L2224/73204; H01L2224/73259; H01L2224/73267; H01L2224/82001; H01L2224/83005; H01L2224/92125; H01L2224/92244; H01L2224/94; H01L2225/1035; H01L2225/1058; H01L23/28; H01L23/31; H01L23/3128; H01L23/3171; H01L23/367; H01L23/481; H01L23/49816; H01L23/49827; H01L23/52; H01L23/528; H01L23/5389; H01L23/562; H01L24/10; H01L24/11; H01L24/12; H01L24/19; H01L24/20; H01L24/27; H01L24/28; H01L24/93; H01L24/96; H01L24/97; H01L25/105; H01L25/50; H01L2924/10252; H01L2924/10253; H01L2924/10272; H01L2924/10322; H01L2924/10324; H01L2924/10329; H01L2924/1033; H01L2924/10335; H01L2924/141; H01L2924/143; H01L2924/1433; H01L2924/14335; H01L2924/1434; H01L2924/1461; H01L2924/18161; H01L2924/18162; H01L2924/3511 | September 02, 2022 |
EP3540771B1 | Grant | SCHUTZSCHALTUNG MIT EINER FET-VORRICHTUNG, DIE VON EINEM GESCHÜTZTEN BUS MIT DER MASSE GEKOPPELT IST | H01L27/0255; H01L27/0262; H01L27/0274; H01L27/0285; H01L29/73; H02H9/005; H02H9/025; H02H9/04; H02H9/041; H02H9/046; H03K17/08116 | August 31, 2022 |
CN114978143A | Application | 用于CMOS信号路径的前馈电流补偿 | G05F1/10; G05F1/56; G05F1/565; G05F1/577; G11C11/4074; H02M1/0045; H02M1/15; H02M3/07; H03K17/04206; H03K17/16; H03K17/56; H03K19/0013; H03K19/00315; H03K19/00361; H03K19/00384; H03K19/017545; H03K19/018571 | August 30, 2022 |
Top Inventors by Filings (Count by publication)
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