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View up-to-date information on Tianshui Huatian Technology Co Ltd patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| CN116564922A | Application | Lead bonding clamp and use method thereof | H01L23/49541; H01L23/49565 | August 08, 2023 |
| CN116564829A | Application | High-density array pin packaging structure and manufacturing method thereof | H01L21/4821; H01L21/56; H01L23/3128 | August 08, 2023 |
| CN116564832A | Application | Suspended frame packaging structure and manufacturing method | H01L21/4821; H01L21/56; H01L23/3121; H01L23/49548; H01L23/49565 | August 08, 2023 |
| CN116525565A | Application | High-heat-dissipation packaging structure and preparation method thereof | H01L21/56; H01L23/16; H01L23/367; H01L23/3736 | August 01, 2023 |
| CN116441135A | Application | Wireless charging electric oiling tool | B05C17/0052; B05C17/0103; B05C17/012; Y02T10/70 | July 18, 2023 |
Top Inventors by Filings (Count by publication)
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