United Microelectronics Corp - Company Profile
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United Microelectronics Corp (UMC) is a semiconductor foundry that offers circuit design, mask tooling, wafer fabrication, assembly, and testing solutions. UMC’s comprehensive IC processing technologies and manufacturing solutions include logic/mixed-signal, embedded non-volatile-memory, 3D FinFET, RF CMOS, Embedded Non-Volatile Memory, Embedded High Voltage, BCD, RF SOI, GaAs (Gallium Arsenide), GaN (Gallium Nitride), and 2.5D/3D advanced packaging technology. It offers backend services such as turnkey solutions, testing services, circuit design, mask tooling, wafer fabrication, and assembly and testing. The company’s products find application in communication devices, consumer electronics, computer, and high-volume application such as networking, telecommunications, internet, multimedia PCs and graphics It has operations across Taiwan, China, Japan, Korea, Singapore, Hong Kong, Europe, and the US. UMC is headquartered at Hsinchu City, Taiwan.
Headquarters
Taiwan
Address
No.3, Li-Shin Road, Hsinchu Science Park, 300094
Website
www.umc.com
Telephone
886 3 5782258
No of Employees
19,426
Industry
Technology and Communications
Ticker Symbol & Exchange
2303 (TPE)
Revenue (2024)
$7.6B
2.3%
(2024 vs 2023)
EPS
XYZ
Net Income (2024)
XYZ
-11.6%
(2024 vs 2023)
Market Cap*
$61.0B
Net Profit Margin (2024)
XYZ
-13.6%
(2024 vs 2023)
* As of and is in US$
United Microelectronics Corp premium industry data and analytics
Products and Services
| Products | Services |
|---|---|
| Wafers | Mask Tooling Services |
| Semiconductors | Backend |
| Solutions: | Turnkey Solutions |
| XYZ | XYZ |
| XYZ | XYZ |
| XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2026 | New Products/Services | In May, the company introduced its 14nm embedded high-voltage FinFET platform. |
| 2026 | New Products/Services | In January, the company and SST released their 28 nm SuperFlash Gen 4 embedded flash platform. |
| 2025 | Contracts/Agreements | In December, the company signed a licensing agreement with imec to transfer imec’s iSiPP300 silicon photonics process. |
Competitor Comparison
| Key Parameters | United Microelectronics Corp | Samsung Electronics Co Ltd | Taiwan Semiconductor Manufacturing Co Ltd | Intel Corp | Semiconductor Manufacturing International Corp |
|---|---|---|---|---|---|
| Headquarters | Taiwan | South Korea | Taiwan | United States of America | China |
| City | Hsinchu | Suwon | Hsinchu | Santa Clara | Shanghai |
| State/Province | - | - | - | California | Shanghai |
| No. of Employees | 19,426 | 129,480 | 85,134 | 85,100 | 19,952 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Stan Hung | Chairman; Chief Strategy Officer | Executive Board | 2008 | - |
| Jason Wang | Director; Chief Executive Officer | Executive Board | 2024 | - |
| Ming Hsu | Chief Operating Officer; President; Director | Executive Board | 2015 | - |
| Chitung Liu | Head - Corporate Governance; Chief Financial Officer; Senior Vice President | Senior Management | 2005 | - |
| Eric Chen | Vice President - Chief Human Resources Officer; Vice President | Senior Management | 2011 | - |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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