Winbond Electronics Corp - Company Profile
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Winbond Electronics Corp (Winbond) designs, manufactures, and sells specialty memory IC products. Its product portfolio includes mobile dynamic random-access memory (DRAM), specialty DRAM, NAND-based MCP, and code storage flash memory. The company also carries out product design, mask making, wafer fabrication, packaging, testing, and marketing of brand name products. Winbond offers low to medium density memory solutions to its global clientele. The company serves the automotive, industrial, communication, computer, and consumer sectors. Winbond provides flash memory products for applications in consumer electronics, mobile devices, automotive electronics, medical electronics, IoT and wearable devices. The company has operations and distributor network in Japan, the US, China, Israel and Hong Kong. Winbond is headquartered in Taichung City, Taiwan.
Headquarters
Taiwan
Address
No.8, Keya 1st Rd, Cntrl Science Industrl Prk, Daya District, Taichung, 428
Website
www.winbond.com
Telephone
886 35 678168
No of Employees
3,625
Industry
Technology and Communications
Ticker Symbol & Exchange
2344 (TPE)
Revenue (2025)
$2.9B
9.6%
(2025 vs 2024)
EPS
XYZ
Net Income (2025)
XYZ
559.2%
(2025 vs 2024)
Market Cap*
$30.1B
Net Profit Margin (2025)
XYZ
498.7%
(2025 vs 2024)
* As of and is in US$
Winbond Electronics Corp premium industry data and analytics
Products and Services
| Products | Services |
|---|---|
| Customized Memory Solution: | Memory Product Foundry Service |
| CUBE(3DCaaS) | |
| PSRAM | |
| XYZ | |
| XYZ | |
| XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2025 | Contracts/Agreements | In December, the company signed a partnership with ChipMOS Technologies Inc to host the Silicon in Synerg, Sustainable Basketball Donation Program. |
| 2025 | New Products/Services | In December, the company launched its new 8Gb DDR4 DRA. |
| 2024 | New Products/Services | In December, the company unveiled the W77T Secure Flash family. |
Competitor Comparison
| Key Parameters | Winbond Electronics Corp | Taiwan Semiconductor Manufacturing Co Ltd | Micron Technology Inc | Nanya Technology Corp | WIN Semiconductors Corp |
|---|---|---|---|---|---|
| Headquarters | Taiwan | Taiwan | United States of America | Taiwan | Taiwan |
| City | Taichung | Hsinchu | Boise | Taishan | Taoyuan |
| State/Province | - | - | Idaho | - | Taoyuan |
| No. of Employees | 3,625 | 85,134 | 53,000 | 3,380 | 1,534 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Arthur Yu-Cheng Chiao | Chairman; Chief Executive Officer | Executive Board | 2017 | - |
| Tung-Yi Chan | Deputy Chief Executive Officer; Vice Chairman | Executive Board | 2020 | - |
| Pei-Ming Chen | President | Senior Management | - | - |
| Pei-Lin Pai | Chief Technology Officer - Advanced Technology Development Group | Senior Management | - | - |
| San-Ha Park | Vice President - Flash Memory IC Business Group | Senior Management | - | - |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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