Wolfspeed Inc - Company Profile
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View up-to-date information on Wolfspeed Inc patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US20230395670A1 | Application | Plasma-based barrier layer removal method for increasing peak transconductance while maintaining on-state resistance and related devices | H01L21/28581; H01L29/2003; H01L29/205; H01L29/42316; H01L29/66462; H01L29/7786 | December 07, 2023 |
| US20230395695A1 | Application | Method for reducing parasitic capacitance and increasing peak transconductance while maintaining on-state resistance and related devices | H01J2237/334; H01J37/321; H01L21/3065; H01L29/2003; H01L29/407; H01L29/66462; H01L29/7786 | December 07, 2023 |
| EP2546865B1 | Grant | Verfahren zur verarbeitung von halbleiterwafern mit siliciumkarbid-leistungsvorrichtungen darauf | H01L21/0485; H01L21/0495; H01L21/268; H01L21/304; H01L21/306; H01L21/425; H01L29/00; H01L29/6606; Y10S438/931 | December 06, 2023 |
| EP4285408A1 | Application | Verkapselte elektronische vorrichtungen mit substraten mit thermisch leitenden haftschichten | H01L2224/0603; H01L2224/32245; H01L2224/48247; H01L2224/4903; H01L2224/73265; H01L23/3121; H01L23/3735; H01L23/4334; H01L23/49562; H01L23/49811; H01L23/49838; H01L23/49861; H01L2924/181; H01L2924/19107 | December 06, 2023 |
| US11837629B2 | Grant | Power semiconductor devices having gate trenches and buried edge terminations and related methods | H01L21/046; H01L29/0615; H01L29/0619; H01L29/0623; H01L29/063; H01L29/0696; H01L29/0878; H01L29/1037; H01L29/1095; H01L29/1608; H01L29/66068; H01L29/66734; H01L29/7397; H01L29/7811; H01L29/7813 | December 05, 2023 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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