Disco Corp - Company Profile

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Disco Corp (Disco) is a manufacturer of semiconductor manufacturing equipment and precision tools. The company’s product portfolio comprises dicing, cutting saws, polishers, laser saws, grinders, wafer mounters, die separators, surface planers, and waterjet saws. It also offers precision processing tools such as dicing blades, grinding wheels, and dry polishing wheels. The company provides solutions such as blade dicing, laser dicing, grinding, dicing before grinding, and Stealth dicing before grinding. It also provides maintenance, training, customer support, disassembly, recycling, and leasing of precision cutting, grinding, and polishing machines. The company has a presence in North America, Europe, and Asia-Pacific. Disco is headquartered in Ota-ku, Tokyo, Japan.

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Headquarters Japan

Address 2-13-11, Omorikita, Ota-Ku, Tokyo, 143-8580


Telephone 81 3 45901111

No of Employees 7,349

Industry Technology and Communications

Ticker Symbol & Exchange 6146 (TYO)

Revenue (2025) $2.8B 11.1% (2025 vs 2024)

EPS XYZ

Net Income (2025) XYZ 9.4% (2025 vs 2024)

Market Cap* $44.7B

Net Profit Margin (2025) XYZ -1.5% (2025 vs 2024)

* As of and is in US$
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Disco Corp premium industry data and analytics

17+

Install Base

Install Base provides a holistic and a granular view of the IT product/service deployments from leading vendors. Explore IT infrastructure categories, solution and product/service areas deployed by a prospect.

1

ICT Spend & Tech Priorities

IT Client Prospector provides intelligence on Disco Corp’s likely spend across technology areas enabling you to understand the digital strategy.

Products and Services

Products Services
Precision Machines Training Services
Laser Saws Customer Equipment Improvement Information
Dicing Saws Troubleshooting Support
XYZ XYZ
XYZ XYZ
XYZ XYZ
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History

History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.

Year Event Description
2026 New Products/Services In February, the company launched a new all-in-one litigation platform for eDiscovery.
2025 New Products/Services In December, the company launched DFG8561, a fully automatic grinder.
2024 Plans/Strategy In January, the company announced its plans to build a cutting-edge plant in Hiroshima, Japan.
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Competitor Comparison

Key Parameters Disco Corp Taiwan Semiconductor Manufacturing Co Ltd Kanematsu Corp Daitron Co Ltd Kulicke & Soffa Industries Inc
Headquarters Japan Taiwan Japan Japan Singapore
City Ota-Ku Hsinchu Chiyoda-Ku Osaka Singapore City
State/Province Tokyo - Tokyo Osaka -
No. of Employees 7,349 85,134 8,604 1,117 2,551
Entity Type Public Public Public Public Public
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Executives
Name Position Board Since Age
Kazuma Sekiya Chief Ethics Officer; Director; General Manager, Engineering R&D Division; President; Chief Executive Officer; Chief Information Officer; Chief Operating Officer Executive Board 2009 59
Takao Tamura Chief Financial Officer; Managing Executive Officer; Chief Privacy Officer; Director; General Manager - Corporate Support Division; Chief Environmental Officer Executive Board 2018 -
Noboru Yoshinaga General Manager-Sales Division; Executive Vice President; Director Executive Board 2019 65
Naoki Abe Managing Executive Officer; General Manager - Manufacturing Division Senior Management - -
Yutaka Nishimura General Manager - Hiroshima Works; Executive Officer Senior Management - -
Non Dignissim Eros Proin vel Convallis 2026 XY
Non Dignissim Eros Proin vel Convallis 2026 XY
Non Dignissim Eros Proin vel Convallis 2026 XY
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