Disco Corp (Disco) is a manufacturer of semiconductor manufacturing equipment. The company offers precision machines, precision processing tools and other products. Its solutions portfolio comprises laser dicing, DBG, blade dicing, grinding, polishing, dicing before grinding (DBG), stealth dicing before grinding (SDBG), and others.

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Disco’s R&D arm focuses on strengthening its R&D capabilities to address the growing demands in the semiconductor and electronic components markets. The company carries out manufacturing at its Kure Plant, Kuwabata Plant, Haneda Plant and Chino Plant plants in Japan. Its aims to expand its R&D facilities to handle a larger number of R&D projects, driven by the increasing influence of AI, IoT, next-generation communication technology, self-driving advancements, and carbon neutrality efforts. The company enhances its production systems by leveraging the Haneda R&D Center to conduct verifications for mass production, which were previously performed at its production sites in Hiroshima and Nagano. This further streamlines the process, enabling smoother transitions from development to production. Disco strives to create a more flexible and robust R&D infrastructure that can adapt to diverse development needs. The company aims to bolster its production stability and enhance its ability to meet the future demands of the semiconductor and electronic components industries.