Malaysian Pacific Industries Bhd - Company Profile
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Malaysian Pacific Industries Bhd (MPI), a subsidiary of Hong Leong Group, is primarily an investment holding company that provides outsourced semiconductor packaging and testing services. The company is involved in the manufacturing, assembly, testing, and sale of electronic components, semiconductor devices, integrated circuits, and lead frames. The company provides micro lead frame package, system in package, arrays, flip chip on lead frame, MEM sensors, micro-ICs, and components, power management chips, and power devices. It also offers turnkey packaging, value added services including auto inspection system, lead frame taping and test services. The company serves information technology, consumer electronics, industrial, and automotive industries. MPI has business operations in Ireland, Taiwan, Malaysia, the US, Singapore, China, and Other countries. MPI is headquartered in Kuala Lumpur, Malaysia.
Headquarters
Malaysia
Address
Jalan Lapangan Terbang, Perak Darul Ridzuan, Kuala Lumpur, Kuala Lumpur (Federal Territory of), 31350
Website
mpind.my
Telephone
60 3 20809200
No of Employees
6,508
Industry
Technology and Communications
Ticker Symbol & Exchange
MPI (KUL)
Revenue (2025)
$466.1M
1.7%
(2025 vs 2024)
EPS
XYZ
Net Income (2025)
XYZ
-6.5%
(2025 vs 2024)
Market Cap*
$2.4B
Net Profit Margin (2025)
XYZ
-8.0%
(2025 vs 2024)
* As of and is in US$
Malaysian Pacific Industries Bhd premium industry data and analytics
Products and Services
| Products | Services |
|---|---|
| Micro Leadframe Package | - |
| System in Package | Test Services |
| Flip Chip | Turnkey Packaging |
| XYZ | |
| XYZ | |
| XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2025 | Contracts/Agreements | In September, the company entered into an agreement to acquire Infineon Technologies (Thailand) Ltd for US$77.95 million. |
| 2021 | Contracts/Agreements | In December, the company entered into an agreement to invest in land for its new plant in Suzhou, China. |
| 2021 | Corporate Changes/Expansions | In December, the company announced to open a new plant in Suzhou, China. |
Competitor Comparison
| Key Parameters | Malaysian Pacific Industries Bhd | Amkor Technology Inc | FormFactor Inc | Orient Semiconductor Electronics Ltd | Genetec Technology Berhad |
|---|---|---|---|---|---|
| Headquarters | Malaysia | United States of America | United States of America | Taiwan | Malaysia |
| City | Kuala Lumpur | Tempe | Livermore | Kaohsiung | Bandar Baru Bangi |
| State/Province | Kuala Lumpur (Federal Territory of) | Arizona | California | - | Selangor |
| No. of Employees | 6,508 | 28,300 | 2,238 | 5,300 | 345 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Lau Ping Ong | Chief Financial Officer | Senior Management | 2023 | 48 |
| Datuk Kwek Leng San | Chairman | Non Executive Board | 1993 | 69 |
| Manuel Zarauza Brandulas | Managing Director; Director | Executive Board | 2016 | 53 |
| Lee Choe Khean | Head - China Operations, Carsem Semiconductor (Suzhou) Co., Ltd and Carsem Advanced Technology (Suzhou) Co., Ltd | Senior Management | 2022 | 57 |
| Raymond Shi Yan | General Manager - Carsem Semiconductor (Suzhou) Co., Ltd | Senior Management | 2022 | 50 |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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