Malaysian Pacific Industries Bhd (MPI), a subsidiary of Hong Leong Group, is primarily an investment holding company, provides outsourced semiconductor packaging and testing services (OSAT). The company manufactures, assembles, tests, and sells electronic components, semiconductor devices, integrated circuits, and lead frames. MSI serves industries that require semiconductor packaging and testing solutions.

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MPI's R&D arm focuses on building long-term relationships with customers by developing technology roadmaps together and utilizing its in-house R&D center with dedicated production capabilities to perform product qualification. The company R&D activities are focused on automotive and industrial segments with leaded package, MOSFET with clip solution packages like TOLL (Thin Outline L-Lead), TOLT (Transistor Outline Leaded Topside), sTOLL (small Thin Outline L-lead), LFPAK (Loss Free Package), and ESSOP (Exposed-pad Shrink Small-Outline Package). MPI recent technology projects pursued during FY24 include applications in electric vehicles, automotive sensors, industrial sensors, MEMS and sensors, artificial intelligence and smart sensors, renewable energy, radio frequency communication, and electronic static discharge and transient voltage suppressors. In FY 2024, the company incurred an expenditure of MYR 42.2 million on its R&D, which stood at 2% of its total revenue.