Malaysian Pacific Industries Bhd (MPI), a subsidiary of Hong Leong Group, is primarily an investment holding company, provides outsourced semiconductor packaging and testing services (OSAT). The company manufactures, assembles, tests, and sells electronic components, semiconductor devices, integrated circuits, and lead frames. MPI serves industries that require semiconductor packaging and testing solutions. It also offers turnkey test services for mixed-signal, RF, analog, power and digital devices. The company's product offerings include micro leadframe packages, system in package, flip chip, MEM sensors, integrated circuits and Components, Power Management Chips, Power Devices, Small Outline Packages, and RF Front End Modules. MPI also provides test services and turnkey packaging services. The company offers its products to a wide range of customers in the electronics and semiconductor sectors.

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MPI is actively engaged in R&D initiatives to enhance long-term competitiveness and technological advancement. The company prioritizes R&D as a key driver, focusing on expanding capabilities across the semiconductor value chain, including advanced packaging technologies such as flip-chip, system-in-package (SiP), Quad Flat No-Lead (QFN), and Land Grid Array (LGA) solutions. MPI is also investing in next-generation packaging technologies like Vapour Phase Decomposition (VPD) and Backside Grinding and Backside Metallisation (BGBM) to support power management and AI-driven applications. The company is developing advanced power module packaging technologies to support miniaturization, electrical performance, long-term reliability, thermal dissipation, and power efficiency, particularly for automotive semiconductor and AI data center applications. The R&D unit of MPI is the in-house R&D center, which plays a crucial role in developing technology roadmaps, performing product qualification, and developing advanced materials. The unit is responsible for driving innovation, technology advancement, and infrastructure development to support the company's long-term expansion and competitiveness. In FY2026, the company incurred an expense of MYR54.7 million on its R&D activities, which grew 17.4%YoY and stood at 2.1% of the company’s total revenue.