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Shinko Electric Industries Co Ltd: Segment Analysis

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Business Description

Shinko Electric Industries Co Ltd (Shinko) is a manufacturer of semiconductor packages. The company manufactures products such as flip-chip type packages, plastic-BGA substrates, IC assembly, lead frames, glass-to-metal seals, heat spreaders and ceramic electrostatic chuck. Its products find application in computing and networking, mobile, industrial and IoT and automotive industries. Shinko’s core technologies include ceramic processing, organic material processing, photolithography and etching, high-precision plating, hermetic sealing, multi-layer technology, die making and precision and machining and multi-layer technology.

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R&D Overview

Shinko's R&D activities focus on developing new products and improving the existing products. The company’s R&D offers material and process development and basic research in electricity, physics, chemistry, and other fundamental sciences. Shinko has been accelerating design, analysis, simulation, evaluation, and analytical technology for development and productization. The company introduced advanced technology developments in R&D such as patterning and high integration technology, interconnect technologies for fine-pitch IC Chip, and plating technology. It operates two R&D centers, Kurita Sogo and Shinko R&D centers in Japan.

Business Segments

Overview

Offers stamped leadframes, ceramic electrostatic chuck, glass to metal seals and heat spreaders. Main applications are automobiles, smartphones, PCs, consumer products, semiconductor manufacturing equipment, communications equipment, etc.

Performance

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Overview

Offers Flip-Chip type package, Plastic BGA Substrates, IC Assemblies. Main application PCs, servers, smartphones, automobiles, and consumer products, among others.

Performance

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Performance

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