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View up-to-date information on Shinko Electric Industries Co Ltd patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US20230397342A1 | Application | Wiring board, semiconductor device, and wiring board manufacturing method | H01L23/49822; H05K1/112; H05K2201/09563; H05K3/205; H05K3/4644 | December 07, 2023 |
| US11837530B2 | Grant | Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame | H01L23/49517; H01L23/4952; H01L23/49548; H01L23/49568; H01L23/49575; H01L23/49827; H01L24/45; H01L24/49; H01L2924/181 | December 05, 2023 |
| US11839022B2 | Grant | Circuit board | A61B5/25; H05K1/0281; H05K1/189; H05K2201/10151 | December 05, 2023 |
| US20230382076A1 | Application | Substrate | B32B15/08; B32B18/00; B32B3/20; B82Y30/00 | November 30, 2023 |
| US20230384040A1 | Application | Latent heat storage | F28D20/0056; F28D20/021 | November 30, 2023 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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