Taiwan Semiconductor Manufacturing Co Ltd - Company Profile
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Taiwan Semiconductor Manufacturing Co Ltd (TSMC) provides semiconductor foundry services. It offers design, advance packaging services, mask making, testing and eFoundry services. The company offers several logic and specialty technologies such as mixed signal/radio frequency (MS/RF), power IC/bipolar-CMOS-DMOS (BCD), micro-electromechanical systems (MEMS), gallium nitride (GaN), display drivers, complementary metal-oxide-semiconductor (CMOS) image sensors, embedded flash and emerging memory technologies. TSMC 's products find use in a wide range of applications including high-performance computing, smartphones, digital consumer electronics, internet of things (IoT), and automotive. The company has operations in North America, Europe and Asia Pacific. TSMC is headquartered in Hsinchu, Taiwan.
Headquarters
Taiwan
Address
No.8, Li-Hsin 6th Road, Hsinchu Science Park, 300
Website
www.tsmc.com
Telephone
886 3 5636688
No of Employees
85,134
Industry
Technology and Communications
Ticker Symbol & Exchange
2330 (TPE)
Revenue (2024)
$122.3B
31.6%
(2024 vs 2023)
EPS
XYZ
Net Income (2024)
XYZ
46.4%
(2024 vs 2023)
Market Cap*
$1,955.0B
Net Profit Margin (2024)
XYZ
11.3%
(2024 vs 2023)
* As of and is in US$
Taiwan Semiconductor Manufacturing Co Ltd premium industry data and analytics
Products and Services
| Products | Services | Brands |
|---|---|---|
| Mixed Signal/Radio Frequency (MS/RF) | Design Services | Open Innovation Platform |
| Power IC/Bipolar-CMOS-DMOS (BCD) | Mask Services | CoWoS |
| Micro-Electromechanical Systems (MEMS) | Testing Services | TSMC-SoIC |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2025 | Plans/Strategy | In October, the company commenced constructing a new chip fabrication plant for its 1.4 nm or A14 chips. |
| 2025 | Contracts/Agreements | In October, the company signed an agreement to construct a second factory focused on 6‑nm chips in Kumamoto, Japan. |
| 2025 | Contracts/Agreements | In May, the company along with National Science and Technology Council and Foxconn signed a partnership with NVIDIA to develop AI infrastructure in Taiwan. |
Competitor Comparison
| Key Parameters | Taiwan Semiconductor Manufacturing Co Ltd | Semiconductor Manufacturing International Corp | United Microelectronics Corp | GlobalFoundries Inc | Actions Semiconductor Co., Ltd. |
|---|---|---|---|---|---|
| Headquarters | Taiwan | China | Taiwan | United States of America | China |
| City | Hsinchu | Shanghai | Hsinchu | Malta | Zhuhai |
| State/Province | - | Shanghai | - | New York | Guangdong |
| No. of Employees | 85,134 | 19,952 | 19,426 | 14,000 | 589 |
| Entity Type | Public | Public | Public | Public | Private |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| C.C. Wei | Chief Executive Officer; Chairman | Executive Board | 2024 | - |
| Wendell Huang | Chief Financial Officer; Senior Vice President - Finance | Senior Management | 2024 | - |
| Cliff Hou | Deputy Co-Chief Operating Officer; Chief Information Security Officer; Senior Vice President | Senior Management | 2024 | - |
| Wei-Jen Lo | Senior Vice President - Corporate Strategy Development | Senior Management | - | - |
| Jun He | Vice President - Advanced Packaging Technology and Service | Senior Management | - | - |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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