Taiwan Semiconductor Manufacturing Co Ltd (TSMC) is a manufacturer of semiconductors. It offers wide range of wafer fabrication processes which include process to manufacture complementary metal-oxide silicon semiconductor (CMOS) logic, embedded memory, radio frequency, mixed-signal, bipolar complementary metal oxide silicon (BiCMOS), Micro-Electromechanical Systems (MEMS), Gallium Nitride (GaN), Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensors.

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TSMC’s R&D arm focuses on developing cutting-edge technologies and design solutions to support customers' product success. TSMC's R&D efforts extended beyond complementary metal oxide semiconductor (CMOS) logic to encompass a wide range of semiconductor technologies for mobile system-on-chip (SoC) and other applications. In 2022, its R&D activities resulted into advancements in the integrated interconnect and packaging solution, 3DFabricTM, such as HBM3 certification, the qualification of InFO_PoP Gen-8 for mobile applications, and the development of the next-generation InFO_PoP with backside redistribution layers (RDL). In FY2022, the company incurred expenses of TWD163,262.2 million on R&D, which as a percentage of its revenue stood at 7.2%.