Unisem (M) Bhd (Unisem) is a global provider of semiconductor assembly and test services, offering comprehensive turnkey solutions for many of the world's leading electronics companies. The company specializes in advanced packaging and leadframe packaging services, including integrated circuit (IC) packaging technologies such as wafer bump, redistribution layer design, flip chip interconnect, and wafer level chip scale packaging (WLCSP). Unisem also provides a wide range of leadframe and substrate IC packages.

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Unisem's R&D initiatives are strategically aligned with its Technology Road Map, focusing on developing technical capabilities to meet market demands and optimize operational efficiency. The company has made significant advancements in its R&D initiatives, including the completion of projects such as the Power Stacked Module Packages, which enhance power density and performance. Additionally, Unisem developed a new concept MEMS Microphone in collaboration with customers to improve sound quality, which is now in production. As of December 2025, Unisem has secured a total of 31 patents to protect its proprietary technologies and processes. The company's R&D efforts also focus on enhancing process efficiency and adopting automation technologies to improve environmental performance, such as energy and emission efficiency. In FY2025, the company incurred expenses of MYR9.6 million on R&D, which as a percentage of revenue, stood at 1%.