Unisem (M) Bhd - Company Profile
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View up-to-date information on Unisem (M) Bhd patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US20190259731A1 | Application | Substrate based fan-out wafer level packaging | H01L21/481; H01L21/4853; H01L21/4857; H01L21/486; H01L21/561; H01L21/568; H01L21/6835; H01L2221/68345; H01L2224/13; H01L2224/13144; H01L2224/16; H01L2224/16225; H01L2224/81; H01L2224/81001; H01L2224/81192; H01L2224/81801; H01L2224/95001; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L23/49827; H01L23/49838; H01L23/562; H01L24/81; H01L24/97; H01L2924/15311; H01L2924/15331; H01L2924/181; H01L2924/351 | August 22, 2019 |
| US20190181095A1 | Application | Emi shielding for discrete integrated circuit packages | H01L21/561; H01L2224/32245; H01L2224/48137; H01L2224/48247; H01L2224/48257; H01L2224/48463; H01L2224/48464; H01L2224/73265; H01L2224/92247; H01L23/28; H01L23/3121; H01L23/3135; H01L23/4952; H01L23/49548; H01L23/49575; H01L23/552; H01L24/48; H01L24/49; H01L24/73; H01L24/97; H01L2924/00014; H01L2924/181; H01L2924/19107; H01L2924/3025 | June 13, 2019 |
| CN108063094A | Application | Substrate based fan-out wafer level packaging | H01L2021/60007; H01L2021/60022; H01L21/481; H01L21/4853; H01L21/4857; H01L21/486; H01L21/56; H01L21/561; H01L21/568; H01L21/6835; H01L2221/68345; H01L2224/10; H01L2224/13111; H01L2224/13116; H01L2224/13144; H01L2224/16227; H01L2224/81005; H01L2224/81192; H01L2224/81801; H01L2224/81815; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L23/49827; H01L23/49838; H01L23/562; H01L24/10; H01L24/81; H01L24/97; H01L2924/15311; H01L2924/15331; H01L2924/351 | May 22, 2018 |
| US20180130720A1 | Application | Substrate based fan-out wafer level packaging | H01L21/4857; H01L21/561; H01L21/568; H01L2224/16225; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L23/562; H01L2924/15311; H01L2924/181 | May 10, 2018 |
| US20180130769A1 | Application | Substrate based fan-out wafer level packaging | H01L21/481; H01L21/4853; H01L21/4857; H01L21/486; H01L21/561; H01L21/568; H01L21/6835; H01L2221/68345; H01L2224/13111; H01L2224/13116; H01L2224/13144; H01L2224/16227; H01L2224/81005; H01L2224/81192; H01L2224/81801; H01L2224/81815; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L23/49827; H01L23/49838; H01L23/562; H01L24/81; H01L24/97; H01L2924/15311; H01L2924/15331; H01L2924/351 | May 10, 2018 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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