BE Semiconductor Industries NV - Company Profile
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BE Semiconductor Industries NV (Besi) manufactures, develops, markets and sells assembly equipment for semiconductor and electronics industries. The company’s product portfolio comprises die attach equipment, smart manufacturing, packaging equipment, and plating equipment. It also offers after-sales services including spares, tooling, and customer support. Besi serves assembly subcontractors, chip manufacturers, and electronics and industrial companies. The company’s products find applications in mobile devices, automotive components and sensors, computing, data mining, cloud computing and peripherals, internet of things, and augmented reality, advanced medical equipment, solar lithium battery, LED devices, and renewable energy applications. The company offers its products under Besi, Datacon, Esec, Fico, and Meco brand names. It operates through a network of production facilities sales and service offices across Europe, Asia-Pacific, and North America. Besi is headquartered in Duiven, Gelderland, the Netherlands.
Headquarters
Netherlands
Address
Ratio 6, Duiven, Gelderland, 6921RW
Website
https://www.besi.com/
Telephone
31 26 3194500
No of Employees
1,840
Industry
Technology and Communications
Ticker Symbol & Exchange
BESI (AMS)
Revenue (2025)
$667.1M
-2.7%
(2025 vs 2024)
EPS
XYZ
Net Income (2025)
XYZ
-27.7%
(2025 vs 2024)
Market Cap*
$24.9B
Net Profit Margin (2025)
XYZ
-25.7%
(2025 vs 2024)
* As of and is in US$
BE Semiconductor Industries NV premium industry data and analytics
Products and Services
| Products | Services | Brands |
|---|---|---|
| Die Attach System | Marketing | Besi |
| Packaging Equipment | Selling of Semiconductor Equipment | Datacon |
| Plating Equipment | Customer Support | Esec |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2025 | Contracts/Agreements | In May, the company secured a US$20 million contract for five TCB Next systems from a semiconductor manufacturer. |
| 2025 | Stake Sale | In April, the company sold its 9% stake to Applied Materials, Inc, a materials engineering solutions provider. |
| 2024 | Contracts/Agreements | In May, the company secured an order for 26 hybrid bonding systems from a semiconductor logic manufacturer. |
Competitor Comparison
| Key Parameters | BE Semiconductor Industries NV | Lam Research Corp | Disco Corp | ASMPT Ltd | Tokyo Seimitsu Co Ltd |
|---|---|---|---|---|---|
| Headquarters | Netherlands | United States of America | Japan | Hong Kong | Japan |
| City | Duiven | Fremont | Ota-Ku | Singapore | Tokyo |
| State/Province | Gelderland | California | Tokyo | - | Tokyo |
| No. of Employees | 1,840 | 19,000 | 7,349 | 10,300 | 2,767 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Richard W. Blickman | Chief Executive Officer | Senior Management | 1995 | 72 |
| Christoph Scheiring | Senior Vice President - Die Attach | Senior Management | - | 56 |
| Jeroen Kleijburg | Senior Vice President - Packaging | Senior Management | - | 52 |
| Jong Kwon Park | Senior Vice President - Sales and Customer Service APAC | Senior Management | - | 60 |
| Rene Hendriks | Senior Vice President - Sales Europe/North America | Senior Management | - | 65 |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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