BE Semiconductor Industries NV - Company Profile

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BE Semiconductor Industries NV: Patents

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View up-to-date information on BE Semiconductor Industries NV patents, including inventor and filing insights.

Patent Trends

Publication Identifier Document Type Title Classification-CPC Publication Date
KR102597252B1 Grant Method for mounting semiconductors provided with bumps on substrate locations of a substrate H01L21/48; H01L21/50; H01L21/52; H01L21/67011; H01L21/67121; H01L21/67144; H01L21/67282; H01L21/67712; H01L21/68; H01L21/681; H01L22/12; H01L2224/16225; H01L2224/75; H01L2224/75702; H01L2224/75753; H01L2224/75824; H01L2224/81; H01L2224/81132; H01L23/053; H01L23/544; H01L24/03; H01L24/11; H01L24/16; H01L24/75; H01L24/81; H01L24/82; H01L2924/00014 November 01, 2023
KR102595494B1 Grant 캐리어 상에 장착된 전자 컴포넌트들을 캡슐화하기 위한 몰드 부품을 지지하기 위한 프레스 부품 및 프레스 부품을 포함하는 프레스 B29C45/14655; B29C45/1744; B29L2031/3406; B30B15/007; B30B15/06 October 30, 2023
DE102022107897A1 Application Messvorrichtung basierend auf kombinierter optischer 2d- und 3d-bilderfassungsverfahren, fertigungssystem und inspektionssystem G01B11/2441; G01B9/02029; G01B9/02058; G01B9/02091 October 05, 2023
WO2023187765A1 Application Messvorrichtung basierend auf kombinierter optischer 2d- und 3d- bilderfassungsverfahren G01B11/2441; G01B9/02029; G01B9/02058; G01B9/02091 October 05, 2023
US20230284426A1 Application Apparatus for mounting components on a substrate G05B2219/45031; H01L21/67144; H01L21/67276; H01L21/681; H01L2224/75753; H01L2224/75824; H01L2224/75842; H01L2224/7598; H01L2224/81121; H01L24/741; H01L24/75; H05K13/0413; H05K13/046; H05K13/0815 September 07, 2023
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Top Inventors by Filings (Count by publication)

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