BE Semiconductor Industries NV (Besi) designs, develops, manufactures, markets, sells and services semiconductor assembly equipment. It serves semiconductor and electronics industries. Besi's key areas of focus include wafer level and substrate assembly solutions, which are crucial for applications in data centers, PCs, tablets, servers, smartphones, and AI applications. The company also offers services such as marketing, selling of semiconductor equipment, customer support, after-sales services, spares and tooling, and a webshop.

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Besi’s R&D program is centered on advancing its die attach and packaging technologies to meet the tightening precision, throughput, and reliability requirements of next-generation semiconductors. A key priority is the enhancement of sub-micron accuracy hybrid bonding systems, aimed at enabling finer-pitch interconnects and improved alignment performance for leading-edge logic and memory devices, as well as emerging co-packaged optics architectures where optical and electrical components must be integrated with extremely tight tolerances. In parallel, Besi is developing advanced chip-to-wafer thermocompression bonding (TCB) platforms to support high-performance integration across logic, memory, and photonics applications. These initiatives are designed to improve bonding quality, process control, and manufacturing efficiency, helping customers scale advanced packaging approaches used in high-bandwidth, high-density designs. Besi is also investing in next-generation flip chip and multi-module die attach solutions to address mainstream mobile and computing demand, while extending capability for advanced photonics markets that require robust handling of sensitive devices and more complex module assembly. Complementing these efforts, the company is completing a series of enhancements to its next-generation mainstream die bonding, packaging, and plating platforms—positioning its product portfolio to be production-ready and competitive as the industry prepares for a potential market upcycle in 2026. Besi has R&D facilities in Duiven and Drunen, the Netherlands; Steinhausen, Switzerland; Radfeld, Austria; and Singapore. In FY2025, it incurred expenses of EUR81 million on R&D, which as a percentage of revenue, stood at 13.7%.