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Powertech Technology Inc (PTI) is a semiconductor company. It is primarily engaged in the manufacturing, packaging, testing, research and development, design, assembly, and sale of various integrated circuit products. The company's main activities include IC assembly, final testing, burn-in, and laser mark printing. PTI offers a wide range of products and services such as high pin-count thin small outline package (TSOP) packaging and testing services, quad flat no-leads (QFN), multi-chip packaging (MCP, S-MCP), and ball grid array (wBGA, FBGA) IC packaging and testing services, among others. PTI markets these products under BF2O, InPUT, PTI, PTI Group, CHIEFS, FOiP, CLIP, ePLB, ePLP, PiFO trademarks. The company's products are used in a variety of applications, including mobile memory packaging, wafer testing, and system-in-package packaging. It serves international customers and has expanded its production base to serve the local automotive electronics and IoT market. The company operates manufacturing facilities in Taiwan, China, and Japan. PTI is headquartered in Hsinchu, Taipei, Taiwan.
Headquarters
Taiwan
Address
No.10, Datong Road, Hsinchu Industrial Park, Hukou, 303
Website
www.pti.com.tw
Telephone
886 3 5980300
No of Employees
8,895
Industry
Technology and Communications
Ticker Symbol & Exchange
6239 (TPE)
Revenue (2024)
$2.3B
4.1%
(2024 vs 2023)
EPS
XYZ
Net Income (2024)
XYZ
-15.2%
(2024 vs 2023)
Market Cap*
$5.3B
Net Profit Margin (2024)
XYZ
-18.6%
(2024 vs 2023)
* As of and is in US$
Powertech Technology Inc premium industry data and analytics
Products and Services
| Products | Services | Brands |
|---|---|---|
| Secured Digital Memory Cards | TSOP packaging and testing services | BF2O |
| USB memory products | QFN (Quad Flat No-leads) packaging services | InPUT |
| Solid State Drives (SSD) | Multi-Chip Packaging (MCP, S-MCP) packaging and testing services | PTI |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2024 | Contracts/Agreements | In September, Powertec Wireless Technology entered into an agreement with Zetifi to accelerate connectivity across regional and remote areas in Australia. |
| 2020 | Corporate Awards | In October, the company won four awards at the 2020 Taiwan Corporate Sustainability Awards (TCSA) hosted by the Taiwan Institute for Sustainable Energy including, The Most Prestigious Sustainability Awards, Top Ten Domestic Enterprises (Manufacturing), Corporate Sustainability Report Platinum Award, Growth through Innovation Award and Gender Equality Award. |
| 2020 | Corporate Changes/Expansions | In September, the company’s Singapore subsidiary, Powertech Technology (Singapore) Pte. Ltd. was consolidated to a holding company. |
Competitor Comparison
| Key Parameters | Powertech Technology Inc | Taiwan Semiconductor Manufacturing Co Ltd | Sigurd Microelectronics Corporation | Weltrend Semiconductor, Inc. | Taiwan IC Packaging Corp |
|---|---|---|---|---|---|
| Headquarters | Taiwan | Taiwan | Taiwan | Taiwan | Taiwan |
| City | Hukou | Hsinchu | Jhudong | Hsinchu | Kaohsiung |
| No. of Employees | 8,895 | 85,134 | 1,981 | 286 | 435 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| D.K. Tsai | Chairman | Executive Board | 1999 | - |
| Boris Hsieh | Chief Executive Officer; Director | Executive Board | 2020 | - |
| Huck Shen | Chief Financial Officer; Senior Vice President | Executive Board | 2025 | - |
| Y. C. Chen | Chief Operating Officer; Senior Vice President | Senior Management | 2021 | - |
| J.S. Leu | President; Director | Executive Board | 2017 | - |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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