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View up-to-date information on Powertech Technology Inc patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US11769763B2 | Grant | Package structure and manufacturing method thereof | H01L21/561; H01L21/6835; H01L2221/68345; H01L2221/68359; H01L2224/16227; H01L2224/16238; H01L2224/18; H01L2224/19; H01L2224/20; H01L2224/26175; H01L2224/27013; H01L2224/2919; H01L2224/32225; H01L2224/73204; H01L2224/92125; H01L2224/96; H01L23/3121; H01L23/3185; H01L23/49811; H01L23/5383; H01L23/5385; H01L23/5386; H01L23/5389; H01L24/16; H01L24/19; H01L24/20; H01L24/27; H01L24/32; H01L24/73; H01L24/92; H01L25/167; H01L31/0203 | September 26, 2023 |
| US20230290730A1 | Application | Package device and manufacturing method thereof | H01L21/4857; H01L21/56; H01L21/561; H01L21/563; H01L21/568; H01L21/6835; H01L2221/68327; H01L2221/68345; H01L2221/68381; H01L2224/16227; H01L2224/32225; H01L2224/73204; H01L2225/06527; H01L2225/06548; H01L2225/06555; H01L23/053; H01L23/3128; H01L23/49816; H01L23/5381; H01L23/5383; H01L23/5384; H01L23/5385; H01L23/5389; H01L24/16; H01L24/20; H01L24/32; H01L24/73; H01L24/81; H01L24/92; H01L25/0652; H01L25/50 | September 14, 2023 |
| US20230282587A1 | Application | Package device and manufacturing method thereof | H01L21/4853; H01L21/561; H01L21/563; H01L21/565; H01L21/568; H01L21/6835; H01L2221/68345; H01L2224/16235; H01L2224/32225; H01L2224/73204; H01L2224/95001; H01L2224/96; H01L2224/97; H01L23/055; H01L23/16; H01L23/3135; H01L23/49816; H01L23/49833; H01L23/49838; H01L23/5381; H01L23/5383; H01L23/5384; H01L23/5385; H01L23/5386; H01L23/5389; H01L23/562; H01L24/13; H01L24/16; H01L24/32; H01L24/73; H01L24/81; H01L24/92; H01L24/96; H01L24/97; H01L25/0655; H01L25/50; H01L2924/1616; H01L2924/16235; H01L2924/16251; H01L2924/1811; H01L2924/18161; H01L2924/182 | September 07, 2023 |
| TW202329363A | Application | Semiconductor package device and semiconductor package unit | H01L21/561; H01L2224/02331; H01L2224/02371; H01L2224/0239; H01L23/13; H01L23/3128; H01L23/3192; H01L23/49816; H01L23/49822; H01L23/562; H01L24/05 | July 16, 2023 |
| US20230223311A1 | Application | Semiconductor packaging assembly and semiconductor packaging structure | H01L21/561; H01L2224/02331; H01L2224/02371; H01L2224/0239; H01L23/13; H01L23/3128; H01L23/3192; H01L23/49816; H01L23/49822; H01L23/562; H01L24/05; H01L24/16; H01L24/81 | July 13, 2023 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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