Amkor Technology Inc - Company Profile

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Amkor Technology Inc: Overview

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Amkor Technology Inc (Amkor) is a provider of semiconductor packaging and test solutions and services. The company offers turnkey packaging and test services such as semiconductor wafer bump, wafer back-grind, packaging, wafer probe, package design, drop shipment, and system-level and final test services. It serves fabless semiconductor companies, integrated device manufacturers (IDMs), original equipment manufacturers, and contract foundries. Amkor’s products find applications in artificial intelligence, automotive, communications, computing, consumer, industrial, internet of things and networking industries. It offers products and services under Amkor, MicroLeadFrame, Amkor Technology, and SWIFT brand names. The company has business operations across the Americas, Europe, and Asia. Amkor is headquartered in Tempe, Arizona, the US.

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Headquarters United States of America
Address 2045 East Innovation Circle, Tempe, Arizona, 85284
Website www.amkor.com
Telephone 1 480 8215000
No of Employees 28,700
Industry Technology and Communications
Ticker Symbol & Exchange AMKR (NASD)
Revenue (2022) $6.5B -8.3% (2022 vs 2021)
EPS XYZ
Net Income (2022) XYZ -53% (2022 vs 2021)
Market Cap* $7.7B
Net Profit Margin (2022) XYZ -48.8% (2022 vs 2021)
* As of and is in US$
View Amkor Technology Inc financials
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Amkor Technology Inc premium industry data and analytics

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Install Base

Install Base provides a holistic and a granular view of the IT product/service deployments from leading vendors. Explore IT infrastructure categories, solution and product/service areas deployed by a prospect.

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ICT Spend & Tech Priorities

IT Client Prospector provides intelligence on Amkor Technology Inc’s likely spend across technology areas enabling you to understand the digital strategy.

Products and Services

Products Services Brands
Flip Chip Chip Scale Package Design Services Amkor
Flip Chip Ball Grid Array Package Characterization Amkor Technology
Wafer-level Package Products Wafer Bumping MicroLeadFrame
XYZ XYZ
XYZ XYZ
XYZ XYZ
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History

History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.

Year Event Description
2024 Contracts/Agreements In April, the company entered into a partnership with Infineon Technologies AG to strengthen the European semiconductor supply chain and make it more resilient.
2023 Plans/Strategy In November, the company announced its plans to spend US$2 billion to build a new advanced semiconductor packaging and test facility in Arizona, the US.
2023 New Products/Services In March, the company expanded power solutions for automotive electrification.
Dive into past operations, including product releases, deals, acquisitions & more Dive into past operations, including product releases, deals, acquisitions & more Find out more
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Competitor Comparison

Key Parameters Amkor Technology Inc Samsung Electronics Co Ltd Taiwan Semiconductor Manufacturing Co Ltd ASE Technology Holding Co Ltd Jiangsu Changjiang Electronics Technology Co Ltd
Headquarters United States of America South Korea Taiwan Taiwan China
City Tempe Suwon Hsinchu Kaohsiung Wuxi
State/Province Arizona Seoul - - Jiangsu
No. of Employees 28,700 98,557 52,045 101,981 20,135
Entity Type Public Public Public Public Public
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Executives
Name Position Board Since Age
James J. Kim Chairman Executive Board 2009 87
Giel Rutten President; Chief Executive Officer; Director Executive Board 2020 65
Megan Faust Chief Financial Officer; Executive Vice President Senior Management 2022 49
Farshad Haghighi Executive Vice President; Chief Sales Officer Senior Management 2022 60
Susan Y. Kim Vice Chairman Executive Board 2020 60
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
Non Dignissim Eros Proin vel Convallis 2024 XY
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