Amkor Technology Inc - Company Profile
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Amkor Technology Inc (Amkor) is a provider of outsourced semiconductor assembly and test (OSAT) services. The company’s product portfolio includes flip chip chip scale packages, flip chip ball grid array, wafer-level package products, leadframe packages, micro-electro-mechanical systems packages, and advanced system-in-package modules. The company offers products and services under Amkor, Amkor Technology, MicroLeadFrame, and Swift brand names. Amkor’s products find applications in artificial intelligence, automotive, communications, computing, consumer, industrial, internet of things and networking industries. It serves integrated device manufacturers, fabless semiconductor companies, and original equipment manufacturers. The company has operational presence across North America, Europe, the Middle East and Africa and Asia-Pacific. Amkor is headquartered in Tempe, Arizona, the US.
Headquarters
United States of America
Address
2045 East Innovation Circle, Tempe, Arizona, 85284
Website
www.amkor.com
Telephone
1 480 8218276
No of Employees
30,800
Industry
Technology and Communications
Ticker Symbol & Exchange
AMKR (NASD)
Revenue (2024)
$6.7B
-2.9%
(2024 vs 2023)
EPS
XYZ
Net Income (2024)
XYZ
-1.6%
(2024 vs 2023)
Market Cap*
$17.3B
Net Profit Margin (2023)
XYZ
1.3%
(2024 vs 2023)
* As of and is in US$
Amkor Technology Inc premium industry data and analytics
Products and Services
| Products | Services | Brands |
|---|---|---|
| Flip Chip Ball Grid Array Packages | Design Services | Amkor |
| Flip Chip Chip Scale Packages | Wafer Bumping | Amkor Technology |
| Wafer-level Package Products | Package Characterization Services | MicroLeadFrame |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
| XYZ | XYZ | XYZ |
History
History section provides information on new products, mergers, acquisitions, expansions, approvals, and many more key events.
| Year | Event | Description |
|---|---|---|
| 2026 | Contracts/Agreements | In June, the company entered into partnership with Taiwan semiconductor manufacturing company to accelerate advanced packaging in the US. |
| 2026 | Corporate Changes/Expansions | In May, the company expanded its advanced packaging footprint in Arizona, the US. |
| 2024 | Contracts/Agreements | In October, the company signed a memorandum of understanding with TSMC to make available enhanced packaging and test capabilities in Arizona, the US. |
Competitor Comparison
| Key Parameters | Amkor Technology Inc | Samsung Electronics Co Ltd | Taiwan Semiconductor Manufacturing Co Ltd | Luxshare Precision Industry Co Ltd | ASE Technology Holding Co Ltd |
|---|---|---|---|---|---|
| Headquarters | United States of America | South Korea | Taiwan | China | Taiwan |
| City | Tempe | Suwon | Hsinchu | Dongguan | Kaohsiung |
| State/Province | Arizona | - | - | Guangdong | - |
| No. of Employees | 30,800 | 129,480 | 85,134 | 416,197 | 95,492 |
| Entity Type | Public | Public | Public | Public | Public |
Key Financial Charts
Sales Growth
Net Income Growth
Executives
| Name | Position | Board | Since | Age |
|---|---|---|---|---|
| Kevin Engel | President; Director; Chief Executive Officer | Executive Board | 2026 | 54 |
| Susan Y. Kim | Chairwoman | Executive Board | 2024 | 63 |
| Megan Faust | Executive Vice President; Treasurer; Chief Financial Officer | Senior Management | 2019 | 52 |
| Farshad Haghighi | Executive Vice President; Chief Sales Officer | Senior Management | 2022 | 62 |
| Mark N. Rogers | General Counsel; Secretary; Executive Vice President | Senior Management | 2019 | 60 |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
| Non Dignissim Eros | Proin vel | Convallis | 2026 | XY |
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