Amkor Technology Inc - Company Profile
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View up-to-date information on Amkor Technology Inc patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US20220285277A1 | Application | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | H01L2225/0651; H01L2225/06513; H01L2225/06517; H01L2225/06537; H01L2225/06541; H01L2225/06586; H01L23/5381; H01L23/5383; H01L23/5386; H01L23/5387; H01L23/552; H01L25/0652; H01L25/105; H01L25/50 | September 08, 2022 |
| US11437526B2 | Grant | Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices | H01L31/02002; H01L31/0203; H01L31/186; H01L31/1876; G06V40/1318 | September 06, 2022 |
| US11437552B2 | Grant | Semiconductor device with transmissive layer and manufacturing method thereof | H01L21/563; H01L21/6835; H01L2221/68345; H01L2224/13101; H01L2224/16225; H01L2224/73204; H01L2224/73253; H01L2224/81005; H01L2224/81203; H01L2224/81224; H01L2224/81815; H01L2224/92125; H01L24/00; H01L24/16; H01L24/32; H01L24/73; H01L24/92; H01L2924/00014; H01L2924/15311; H01L2924/18161; H01L2924/3511; H01L33/44; H01L33/58; H01L33/62; | September 06, 2022 |
| CN114999944A | Application | 半导体装置和其制造方法 | H01L21/4853; H01L21/4857; H01L21/56; H01L21/561; H01L21/568; H01L21/6835; H01L2221/68304; H01L2221/68318; H01L2221/68331; H01L2221/68345; H01L2221/68363; H01L2224/1132; H01L2224/131; H01L2224/13294; H01L2224/133; H01L2224/16227; H01L2224/16237; H01L2224/16238; H01L2224/32225; H01L2224/73204; H01L2224/81005; H01L2224/81192; H01L2224/81203; H01L2224/81224; H01L2224/81424; H01L2224/81439; H01L2224/81444; H01L2224/81447; H01L2224/81464; H01L2224/81815; H01L2224/8191; H01L2224/81911; H01L2224/81913; H01L2224/81914; H01L2224/83; H01L2224/83005; H01L2224/83104; H01L2224/83192; H01L2224/92; H01L2224/9202; H01L2224/92125; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L23/5389; H01L24/11; H01L24/13; H01L24/16; H01L24/32; H01L24/81; H01L24/83; H01L24/92; H01L24/97; H01L2924/1421; H01L2924/1433; H01L2924/14335; H01L2924/15311; H01L2924/15331; H01L2924/1815; H01L2924/18161 | September 02, 2022 |
| US11430723B2 | Grant | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | H01L21/50; H01L2224/131; H01L2224/1329; H01L2224/133; H01L2224/16227; H01L2224/2919; H01L2224/2929; H01L2224/293; H01L2224/32225; H01L2224/73253; H01L2224/81815; H01L2224/83191; H01L2224/83203; H01L2224/8321; H01L2224/92225; H01L2224/92242; H01L23/3128; H01L23/49811; H01L23/49827; H01L23/49833; H01L23/5389; H01L24/73; H01L24/81; H01L24/83; H01L24/92; H01L2924/181; H01L2924/18161 | August 30, 2022 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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