Amkor Technology Inc - Company Profile
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View up-to-date information on Amkor Technology Inc patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| CN117133742A | Application | 半导体封装及其制造方法 | B81B2207/07; B81B3/0072; B81B7/0048; B81C1/00666; H01L21/568; H01L2224/05599; H01L2224/1131; H01L2224/119; H01L2224/13083; H01L2224/131; H01L2224/13111; H01L2224/13113; H01L2224/13116; H01L2224/13118; H01L2224/13139; H01L2224/13147; H01L2224/1319; H01L2224/13191; H01L2224/13562; H01L2224/13564; H01L2224/1369; H01L2224/14131; H01L2224/14133; H01L2224/14135; H01L2224/14136; H01L2224/16145; H01L2224/16157; H01L2224/16225; H01L2224/16227; H01L2224/2919; H01L2224/32058; H01L2224/32145; H01L2224/32225; H01L2224/32501; H01L2224/45099; H01L2224/48091; H01L2224/48227; H01L2224/48465; H01L2224/48471; H01L2224/73204; H01L2224/73253; H01L2224/73257; H01L2224/81191; H01L2224/81203; H01L2224/81224; H01L2224/81399; H01L2224/81815; H01L2224/81862; H01L2224/81874; H01L2224/83104; H01L2224/85181; H01L2224/85399; H01L2224/92125; H01L2224/92227; H01L2224/92242; H01L2224/95; H01L2224/97; H01L2225/0651; H01L2225/06513; H01L2225/06517; H01L23/055; H01L23/28; H01L23/3121; H01L23/3135; H01L23/4828; H01L23/488; H01L23/552; H01L23/562; H01L24/11; H01L24/13; H01L24/14; H01L24/16; H01L24/32; H01L24/48; H01L24/73; H01L24/81; H01L24/83; H01L24/92; H01L24/95; H01L24/97; H01L25/00; H01L25/065; H01L25/0657; H01L25/074; H01L25/16; H01L2924/00014; H01L2924/1461; H01L2924/16152; H01L2924/1659; H01L2924/351; H01L2924/3512 | November 28, 2023 |
| US11830823B2 | Grant | Semiconductor devices and methods of manufacturing semiconductor devices | H01L21/4853; H01L21/4857; H01L21/565; H01L2224/16227; H01L23/16; H01L23/3128; H01L23/5383; H01L23/5386; H01L23/552; H01L23/562; H01L24/16; H01L2924/3025; H01L2924/3512 | November 28, 2023 |
| US11830860B2 | Grant | Semiconductor devices and methods of manufacturing semiconductor devices | H01L21/565; H01L2224/16148; H01L2224/1703; H01L2224/26145; H01L2224/32145; H01L2224/32225; H01L2224/73204; H01L2224/73253; H01L2224/92225; H01L23/13; H01L23/49816; H01L23/5389; H01L24/16; H01L24/17; H01L24/32; H01L24/33; H01L24/73; H01L24/81; H01L24/83; H01L24/92; H01L25/165; H01L25/50; H01L2924/19105 | November 28, 2023 |
| US11823913B2 | Grant | Method of manufacturing an electronic device and electronic device manufactured thereby | H01L21/561; H01L21/565; H01L21/568; H01L21/6835; H01L2221/68359; H01L2221/68377; H01L2224/12105; H01L2224/131; H01L2224/13147; H01L2224/1319; H01L2224/16227; H01L2224/81002; H01L2224/81005; H01L2224/81203; H01L2224/81815; H01L2224/83005; H01L2224/83102; H01L2224/9202; H01L2224/9211; H01L2224/92125; H01L2224/96; H01L2224/97; H01L23/3128; H01L23/49816; H01L23/49822; H01L24/13; H01L24/16; H01L24/19; H01L24/20; H01L24/81; H01L24/83; H01L24/92; H01L24/96; H01L24/97; H01L2924/181; H01L2924/18161 | November 21, 2023 |
| US20230369240A1 | Application | Semiconductor devices and methods of manufacturing semiconductor devices | H01L21/561; H01L21/78; H01L23/3128; H01L23/552; H01L23/66; H01L25/105; H01Q1/2283 | November 16, 2023 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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