Amkor Technology Inc - Company Profile
Powered by 
All the sales intelligence you need on Amkor Technology Inc in one solution.
- Save hours of research time with a comprehensive
Sales Intelligence Solution.
- Understand how Amkor Technology Inc fits into your total
addressable market and Ideal Customer Profile.
- Gain competitive edge with triggers that tell you
when and how to engage with Amkor Technology Inc.
Get in touch about GlobalData Company reports
Contact the team or request a demo to find out how our data can drive your business forward
Business Description
Amkor Technology Inc (Amkor) is an outsourced semiconductor assembly and test (OSAT) service provider. The company provides turnkey manufacturing services across various markets, including communication, computing, automotive, industrial, and consumer sectors, with applications in smartphones, data centers, artificial intelligence, electric vehicles, and wearables. Amkor serves as a strategic manufacturing partner for semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs).
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
R&D Overview
Amkor’s research and development focuses on developing advancing semiconductor packaging and test solutions to address customer demands for higher performance, greater integration, smaller form factors, and lower costs. Key initiatives include developing heterogeneous integration technologies like multi-chip module solutions, wafer-level and panel-level packaging innovations, copper hybrid bonding for 3D integration, highly integrated SiP modules, advanced automotive packaging, and co-packaged optics technologies. These efforts aim to enhance performance, reduce costs, and support applications in high-performance computing, IoT, mobile devices, automotive, and data centers. The company operates R&D facilities in Korea, Portugal, the US and other locations in Asia. In FY2025, the company spent US$166.7 million on R&D, which as a percentage of revenue stood at 2.5%.
Product Categories
Overview
Includes flip chip chip scale packages (FC CSP), wafer-level packages, and flip chip ball grid array (FCBGA) packages. FC CSP packages are suitable for compact devices like smartphones and tablets, while flip chip stacked chip scale packages (FC SCSP) enable memory stacking for enhanced performance in mobile applications. FCBGA packages, cater to applications prioritizing processing power and speed, featuring high-density routing and customizable configurations to address specific thermal requirements across various sectors, including networking and automotive. The memory products integrate various memory technologies using advanced packaging methods, while wafer-level packages, including wafer-level CSP and WLFO, offer cost-effective solutions for shrinking die sizes. It serves industries such as smartphones, tablets, mobile consumer electronics, networking, storage, computing, automotive, and consumer applications.
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Overview
Include leadframe packages, substrate-based wirebond packages, and cutting-edge micro-electro-mechanical systems (MEMS) packages. Leadframe packages, includes small outline ICs and quad flat packages, provide practical and cost-effective solutions for low to medium pin count analog and mixed signal applications. Substrate-based wirebond packages include stacked CSP and PBGA packages. Offers test services such wafer level, package level, burn-in, system level tests and test development services.
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Geographical Segments
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Performance
Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.
Still looking?
Have you found what you were looking for? From start-ups to market leaders, uncover what they do and how they do it.
Explorer
Access more premium companies when you subscribe to Explorer